芯粒互连不够：多裸片系统中如何解决数据搬运挑战（Arteris BitCast 在线研讨会）
Connecting Chiplets Isn’t Enough – Solving the Data Movement Challenge in Multi-Die Systems
Arteris 将于 11 月 5 日举办 30 分钟 BitCast 线上研讨，主题是多裸片系统中跨裸片边界的数据搬运挑战。
AI 生成摘要 · 以原文为准
Date: Thursday, November 5, 2026
Time: 11:00am PST | 2:00pm EST | 18:00 CET
As SoCs evolve into multi-die systems, getting data across a die-to-die interface is only part of the challenge. Architects must also preserve traffic behavior, bandwidth efficiency and quality of service as communication moves across physical chip boundaries.
Join this 30-minute BitCast as our expert explores how extending NoC connectivity across die boundaries enables engineering teams to scale from monolithic SoCs to multi-die architectures without reinventing the way data moves through the system.
Attendees will gain insight into:
- Why AI is driving the move to multi-die – Practical die-size limitations, heterogeneous compute, process-node optimization and increasing system complexity
- What changes when the SoC crosses a die boundary – The audience understands die-to-die connectivity; the less obvious issue is what happens to data movement, traffic management and QoS
- Why die-to-die connectivity alone isn’t enough – Getting bits between chiplets is different from maintaining the behavior and design intent of the overall system
- Extending the NoC across chip boundaries – Explain the concept of preserving NoC capabilities across D2D links rather than making every chiplet boundary a separate integration problem
- Coherent vs. non-coherent multi-die architectures – Explain when each is needed and naturally introduce FlexGen Multi-Die and Ncore Multi-Die
- What architects should consider before partitioning a design – End with practical guidance: traffic, bandwidth, QoS, coherence, reuse, integration, security and ecosystem interoperability
来源：EE Times · eetimes.com