台积电披露2026年8月资本支出核准，先进制程设备达160.35亿美元
SEC 6-K · TSMC · 2026-09-24 · 6-K - Report of foreign issuer [Rules 13a-16 and 15d-16] · 0001046179-26-000660
台积电向SEC提交6-K，披露2026年8月董事会核准的资本支出：先进制程产能设备160.35亿美元，先进封装、成熟及特殊制程产能设备47.91亿美元，房地产及资本化租赁资产86.16亿美元。同期披露两名副总裁合计增持3,350股，资产处置、股票质押、发债及回购注销均无变化。
AI 生成摘要 · 以原文为准
台积电披露8月董事会核准的资本支出明细，先进制程与先进封装设备支出分开列示，可对照晶圆代工扩产节奏和设备采购方向。
已抓取正式披露文件及最多两份 EX-99 附件。未抓取的其他附件不能据此视为不存在。
6-K
https://www.sec.gov/Archives/edgar/data/1046179/000104617926000660/tsm-monthend6kx20260924.htm
6-K 1 tsm-monthend6kx20260924.htm 6-K
1934 Act Registration No. 1-14700
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
_____________________________
FORM 6-K
_____________________________
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934
For the month of September 2026
(Commission File Number: 001-14700)
_____________________________
Taiwan Semiconductor Manufacturing Company Limited
(Translation of Registrant’s Name Into English)
_____________________________
No. 8, Li-Hsin Road 6
Hsinchu Science Park
Hsinchu 300-096, Taiwan
Republic of China
(Address of Principal Executive Offices)
_____________________________
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F x Form 40-F o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):o
| SIGNATURES | |||||||||||||||||||||||
| Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. | |||||||||||||||||||||||
| Taiwan Semiconductor Manufacturing Company Limited | |||||||||||||||||
| Date: September 24, 2026 | By | /s/ Wendell Huang | |||||||||||||||
| Wendell Huang | |||||||||||||||||
| Senior Vice President and Chief Financial Officer | |||||||||||||||||
Taiwan Semiconductor Manufacturing Company Limited
("TSMC"; NYSE: TSM)
This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors; 5) the unsecured bonds issued by TSMC and its subsidiaries and 6) the cancellation of TSMC common shares for the month of August 2026.
1.The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
| Title | Name | Number of shares held as of | Changes | ||||||||||||||
| 7/31/2026 | 8/31/2026 | ||||||||||||||||
| Vice President | B.Z. Tien | 18,051 | 19,051 | 1,000 | |||||||||||||
| Vice President | Lipen Yuan | 6,650 | 9,000 | 2,350 | |||||||||||||
Note: Shareholdings include shares held by the related parties.
2.The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
None.
3.The acquisition and disposition of assets by TSMC and its subsidiaries:
None.
4.The capital appropriations approved by TSMC board of directors:
(1) Machinery equipment for advanced technology capacity: US$16,035 million.
(2) Machinery equipment for advanced packaging, mature and/or specialty technology capacity: US$4,791 million.
(3) Real estate and capitalized leased assets: US$8,616 million.
5.The unsecured bonds issued by TSMC and its subsidiaries:
None.
6.The cancellation of TSMC common shares:
None.
来源：SEC 6-K · TSMC · sec.gov