据 DigiTimes 报道，TSMC 计划自2027年1月起将代工价格上调3%至6%，先进制程涨幅更高，能见度延伸至2030年。成熟制程与特殊工艺同样涨价，因 AI 需求带动 PMIC、MCU、MOSFET、驱动 IC 及光通信、硅中介层等先进封装相关需求，旧厂已满载；报道还称海外建厂成本高（美国厂为台湾的4至5倍），涨价或持续，竞争对手代工厂可能跟进。消息来自匿名供应链人士。
AI 生成摘要 · 以原文为准
TSMC plans to raise prices 3% to 6% in January 2027, with higher increases for advanced manufacturing processes, DigiTimes reports, adding TSMC’s visibility now extends to 2030.
Prices for older chips and specialty processes will also rise, as TSMC’s older fabs are running full (utilization) amid strong AI demand for power management chips (PMIC), microcontrollers, (MCUs), MOSFETs, MEMs, driver ICs, etc., as well as advanced packaging related: optical communications, silicon interposers, etc.
Rival foundries are likely to follow TSMC’s price increases.
The report also says TSMC price increases are likely to continue due to cost pressures from building fabs overseas, as US fabs cost 4 to 5 times more than Taiwan. The report cites unnamed supply chain sources. $TSM #semiconductors https://www.digitimes.com.tw/tech/dt/n/shwnws.asp?CnlID=1&Cat=40&id=0000769567_EQC46CLT7QXBGK6EIKN7Y
来源：Dan Nystedt · x.com