欧洲顶级半导体研究机构、比利时IMEC加入台积电开放创新平台(OIP)联盟,帮助欧洲企业更便捷地使用台积电先进晶圆厂和封装产线。其商业部门IC-Link将成为首家提供云端管理设计服务的芯片设计服务商,支持混用Synopsys、Cadence和Siemens等多家EDA厂商的工具。
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Europe’s top semiconductor research center, IMEC (Interuniversity Microelectronics Centre) in Belgium, has joined TSMC’s Open Innovation Platform (OIP) alliance to help make it easier for European firms to access TSMC’s advanced fabs and packaging lines, media report, adding its commercial division, IC-Link, will become the first chip design service provider to offer Cloud-managed design services that support multiple EDA vendors – allowing teams to mix and match software tools from Synopsys, Cadence, and Siemens. $TSM $SNPS $CDNS #imec #semiconductors https://www.ctee.com.tw/news/20260923701847-430501
来源:Dan Nystedt · x.com