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今天10月9日周五4 条
  1. EE Times21

    3D IC 设计扩展:趋势、挑战与实用工作流程——Siemens EDA Innovator3D IC 网络研讨会

    Siemens EDA 将举办网络研讨会,由 Futurum Group 分析师讲解 3D IC 市场趋势、采用驱动因素及异构集成、die-to-die 连接、散热和供电等设计挑战。Siemens 专家将介绍 Innovator3D IC 解决方案,并演示早期架构探索、die-封装-系统协同设计等集成化工作流程,帮助团队提升设计效率、降低风险。

    AI 生成摘要 · 以原文为准

10月8日周四
  1. EE Times56

    Rohm 扩大封测外包,联手 Tata Electronics 与 Suchi Semicon 布局印度 OSAT

    Rohm 半导体扩大封测外包,与 Tata Electronics 和 Suchi Semicon 合作,分别承接 TOLL 和 TO-252 封装,先封装现有功率 MOSFET 等老产品并通过资质认证,面向印度两轮车和四轮车市场,未来或扩展至全球供应。晶圆制造仍保留在 Rohm 内部,外包决定综合考虑资本效率、产能和供应链。

    AI 生成摘要 · 以原文为准

  2. Intel38

    推进半导体创新需要整个生态系统的深度协作。很高兴看到 @Intel_Foundry 与 @Applied4Tech 携手合作,加速下一代 AI 赋能技术的落地。

    AI 生成摘要 · 以原文为准

    引用Intel Foundry@Intel_Foundry

    Intel Foundry and @Applied4Tech are collaborating on transistor, interconnect, and advanced packaging innovations for AI computing, connecting R&D at Applied’s EPIC Center in Silicon Valley and Intel’s Oregon campus to accelerate the lab-to-fab pipeline in the U.S. Learn more here: http://ms.spr.ly/6013aWaWP #IntelFoundry

10月7日周三
10月5日周一
10月3日周六
10月2日周五
10月1日周四
9月30日周三
9月29日周二
9月27日周日
  1. Dylan Patel53

    SemiAnalysis 的 Dylan Patel 发推称 Rubin HBM 降规格(Despec)等于 Nvidia 减料,并引用一篇讽刺文:GB200 NVL72 约 400 万美元、GB300 约 500 万美元(重约 1580 kg),Vera Rubin NVL72 已被报至最高 880 万美元,机柜重量受数据中心地板承重限制而价格不受限,$/kg 每代约 1.75 倍增长,外推 2030 年与可卡因批发价出现交叉。内容为戏谑观点而非测算结论。

    AI 生成摘要 · 以原文为准

    引用Dylan Patel@dylan522p

    Fentanyl Grade Compute: Why a GB300 Rack Will Out-Price Blow by Weight in 2030 A GB300 NVL72 weighs roughly 1,580 kg fully populated and recent purchase orders put it at $5M per rack. That is $3,165/kg. Strip out the 1.5 tons of busbar, manifold and coolant and the GPU packages alone are well into gold territory, but we're pricing the rack, because that's what you actually take delivery of. Where that sits on the illicit commodity curve today ($/kg): $2,400 Cannabis flower $3,165 GB300 NVL72 $3,500 Fentanyl $28,000 Cocaine $65,000 Heroin $138,000 Gold So today NVIDIA ships a product that is denser in value than weed, roughly fentanyl-grade, and still an order of magnitude short of cocaine. For now... GB200 NVL72 was $4M, GB300 is ~$5M, and Vera Rubin NVL72 is already quoted at up to $8.8M at essentially the same rack mass. Rack weight is constrained by the datacenter floor loading; rack price is constrained by nothing. That's ~1.75x $/kg per generation with HBM, CoWoS and power all supply-limited through the decade. Cocaine: Colombia's new president has pledged a hard-line security crackdown with $1B in US aid behind it Every prior crackdown has consolidated the industry into fewer, better-capitalized operators with better logistics and higher yields per hectare. Consolidation is deflationary. We model US wholesale drifting from ~$28k/kg toward ~$12k/kg by 2030 as the supply chain professionalizes. **Crossover: 2030.** Our extrapolated NVL72-class rack hits ~$17k/kg while wholesale cocaine falls to ~$12k/kg. At that point the rational cartel pivots to smuggling racks, except a rack has a fixed 500+ kW power draw, a 3,300 lb forklift requirement and an export-control regime that is actually enforced. Cocaine has none of these problems, which is why it will remain the superior product for anyone without a substation. Key risks to the thesis: US retail coke is still ~$60–200/g, i.e. $60k–200k/kg so the crossover only holds at wholesale. Retail compute (H100 hour on a neocloud) is also marked up, so we consider this an apples-to-apples wholesale comparison. Full model available to Coke Research subscribers.

9月26日周六
  1. SemiAnalysis81

    SemiAnalysis拆解Intel Panther Lake:18A首发RibbonFET与PowerVia,逻辑密度与TSMC N3E相当

    SemiAnalysis对Intel Panther Lake(Core Ultra 7 365)进行拆解,这是首个商用背面供电网络(BSPDN,PowerVia)与Intel首批GAA晶体管RibbonFET的产品。

    AI 生成摘要 · 以原文为准

    关注理由:基于实测截面的18A拆解给出逻辑密度、互连材料与封装细节,对评估先进制程节点竞争格局和GAA、背面供电供应链有参考价值。

9月25日周五
9月24日周四
9月22日周二
8月27日周四
  1. SEC 8-K · NVIDIA99

    NVIDIA 2027财年Q2财报:营收962亿美元,数据中心增长117%

    NVIDIA发布2027财年第二季度(截至2026年7月26日)业绩,营收962亿美元,同比增长106%,环比增长18%;数据中心营收890亿美元,同比增长117%,主要由Blackwell Ultra带动;GAAP和非GAAP毛利率均为75.0%,GAAP摊薄每股收益2.46美元。本季度向股东返还约260亿美元,回购授权剩余约990亿美元。

    AI 生成摘要 · 以原文为准

    关注理由:NVIDIA财报披露供应承诺从1190亿美元增至2790亿美元并主要为采购内存,同时给出Vera Rubin平台量产与Q3指引,反映上游存储与供应链备货力度。

8月25日周二
7月1日周三
  1. TrendForce73

    ASE 据报道将先进封装报价上调逾 20%

    据 MoneyDJ 援引业内人士报道,全球最大封测厂商 ASE 将 CoWoS 与 FoCoS 等先进封装报价上调超过 20%,主要美国客户受影响,ASE 对市场揣测不予置评。报道指出涨价源于原材料成本上升和长期投资支出增加,TSMC 的 CoWoS 产能仍受限、外包持续增加。

    AI 生成摘要 · 以原文为准