SemiAnalysis· @SemiAnalysis_ · X·· 19 小时前AI 评分56
AI 导读
SemiAnalysis表示存储厂商开始认同其关于HBM降规格的判断，SK hynix公开承认16层（16-hi）堆叠难度大，市场转向优先带宽而非容量。作者认为混合键合在HBM中的价值取决于堆叠高度，4层和8层堆叠不存在高度问题，D2W混合键合用于HBM已从何时实现变为是否需要。
AI 生成摘要 · 以原文为准
正文
Memory suppliers are finally acknowledging our HBM de-spec call. SK Hynix publicly said 16-hi is difficult, and the market is now prioritizing bandwidth over capacity. Hybrid bonding’s case in HBM was always stack height, and at 4-hi and 8-hi there is no height problem to solve. D2W hybrid bonding for HBM has gone from a question of when to a question of if. (1/3)🧵
来源：SemiAnalysis · x.com