Kirin 9050 apparently has 1.5 micron pitch HBI die-to-wafer.

I spoke to a US packaging company several weeks ago with standard high performance HBI tools, saying they're beyond 0.75 micron pitch. It's just a case of manufacturing at scale. They're also seeing scaling better on wafer-to-wafer with die-to-wafer having hard limits.

I reiterate, Tau Scaling isn't new. It's a repackaging of what the industry has always done. If you want to get sucked up into the marketing hype, go ahead, but it's still not new. Too many people get sucked up in the marketing hype. It's about the physics.