Dan Nystedt· @dnystedt · X·· 16 小时前AI 评分67
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据媒体报道，TSMC 与 GlobalFoundries 签订总额 20 亿美元的多年期硅中介层供应协议，硅中介层是 TSMC CoWoS 先进封装的关键组件。报道同时称，随供应协议扩大，GlobalFoundries 将在其纽约马尔他厂区扩充产能。
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TSMC signed a US$2 billion multi-year supply deal with GlobalFoundries for silicon interposers, a vital component in TSMC’s CoWoS advanced packaging, media report, adding GlobalFoundries will expand capacity at its Malta, New York fab campus as the supply deal expands. $TSM $GFS #semiconductors https://money.udn.com/money/story/5612/9804045?from=edn_newestlist_cate_side
来源：Dan Nystedt · x.com