TSMC 7 月月度 6-K：未批准新资本开支，发行合计 NT$185 亿无担保债券
SEC 6-K · TSMC · 2026-08-25 · 6-K - Report of foreign issuer [Rules 13a-16 and 15d-16] · 0001046179-26-000545
TSMC 向 SEC 提交 2026 年 7 月月度 6-K。当月董事会未批准新的资本开支，公司发行两档无担保债券：NT$140 亿票面利率 2.03%（2026 年 7 月至 2031 年 7 月）、NT$45 亿票面利率 2.10%（至 2036 年 7 月）。
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已抓取正式披露文件及最多两份 EX-99 附件。未抓取的其他附件不能据此视为不存在。
6-K
https://www.sec.gov/Archives/edgar/data/1046179/000104617926000545/tsm-monthend6kx20260825.htm
6-K 1 tsm-monthend6kx20260825.htm 6-K
1934 Act Registration No. 1-14700
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
_____________________________
FORM 6-K
_____________________________
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934
For the month of August 2026
(Commission File Number: 001-14700)
_____________________________
Taiwan Semiconductor Manufacturing Company Limited
(Translation of Registrant’s Name Into English)
_____________________________
No. 8, Li-Hsin Road 6
Hsinchu Science Park
Hsinchu 300-096, Taiwan
Republic of China
(Address of Principal Executive Offices)
_____________________________
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F x Form 40-F o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):o
| SIGNATURES | |||||||||||||||||||||||
| Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. | |||||||||||||||||||||||
| Taiwan Semiconductor Manufacturing Company Limited | |||||||||||||||||
| Date: August 25, 2026 | By | /s/ Wendell Huang | |||||||||||||||
| Wendell Huang | |||||||||||||||||
| Senior Vice President and Chief Financial Officer | |||||||||||||||||
Taiwan Semiconductor Manufacturing Company Limited
("TSMC"; NYSE: TSM)
This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors; 5) the unsecured bonds issued by TSMC and its subsidiaries and 6) the cancellation of TSMC common shares for the month of July 2026.
1.The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
| Title | Name | Number of shares held as of | Changes | ||||||||||||||
| 6/30/2026 | 7/31/2026 | ||||||||||||||||
| Vice President | B.Z. Tien | 13,051 | 18,051 | 5,000 | |||||||||||||
| Vice President | S.S. Lin | 30,269 | 35,269 | 5,000 | |||||||||||||
Note: Shareholdings include shares held by the related parties.
2.The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
None.
3.The acquisition and disposition of assets by TSMC and its subsidiaries:
Equity investment: NT$0.7 billion of disposition.
4.The capital appropriations approved by TSMC board of directors:
None.
5.The unsecured bonds issued by TSMC and its subsidiaries:
| Issuance | Tranche | Issuance Period | Total Amount (in billions) | Coupon Rate | Repayment and Interest Payment | |||||||||||||||
| 115-3 | A | July 2026 ~ July 2031 | NT$14.0 | 2.03% | Bullet repayment; interest payable annually | |||||||||||||||
| B | July 2026 ~ July 2036 | NT$4.5 | 2.10% | |||||||||||||||||
6.The cancellation of TSMC common shares:
None.
来源：SEC 6-K · TSMC · sec.gov