3D IC 设计扩展：趋势、挑战与实用工作流程——Siemens EDA Innovator3D IC 网络研讨会
Scaling 3D IC design: Trends, Challenges and Practical Workflows
Siemens EDA 将举办网络研讨会，由 Futurum Group 分析师讲解 3D IC 市场趋势、采用驱动因素及异构集成、die-to-die 连接、散热和供电等设计挑战。Siemens 专家将介绍 Innovator3D IC 解决方案，并演示早期架构探索、die-封装-系统协同设计等集成化工作流程，帮助团队提升设计效率、降低风险。
AI 生成摘要 · 以原文为准
By Siemens EDA 10.09.2026 0
Available Exclusively On Demand
3D IC architectures are enabling the next generation of AI, HPC, and advanced semiconductor systems – but scaling these designs introduces new challenges across heterogeneous integration, die-to-die connectivity, thermal behavior, power delivery, and system-level verification.
In this webinar, an industry analyst from Futurum Group will share insights into the latest 3D IC market trends, adoption drivers, and design challenges. Siemens experts will then provide an overview of the Innovator3D IC solution, followed by a workflow demonstration showing how teams can support early architecture exploration, die-package-system co-design, and integrated 3D IC planning.
Join this session to hear an expert industry perspective from Futurum Group and see how Siemens Innovator3D IC enables scalable, efficient 3D IC design workflows from early planning through implementation.
Attendees will gain insight into:
- Key industry trends driving 3D IC adoption for AI, HPC, and advanced semiconductor applications
- Common technical and ecosystem challenges facing 3D IC design teams
- How Siemens Innovator3D IC supports system-level planning and co-design
- How an integrated workflow can help teams improve design efficiency, reduce risk, and accelerate development
- What a practical 3D IC workflow looks like through a live product demonstration
3D IC, HIGH PERFORMANCE COMPUTING (HPC)
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来源：EE Times · eetimes.com