Dylan Patel· @dylan522p · X·· 18 天前AI 评分46
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我想用这张照片，因为它是实际封装，看起来帅多了。 上方黑色区域是 DRAM，但还没研磨。 来自我们日立 XTEM 的横截面即将发布 🤫
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I wanted to use this photo because it's the actual package and looks way cooler.
The black area above is the DRAM but not milled yet.
Cross section from our Hitachi XTEM coming soon 🤫
We took the silicon out of the silicon. Quick turn from SemiAnalysis STEEL Teardown Lab: iPhone 18 Pro Max, A20 silicon on TSMC N2. more to follow...在 X 查看被引用的帖子
来源：Dylan Patel · x.com